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208HR - The High Resolution Sputter Coater

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208HR - The High Resolution Sputter Coater Instruments TEDPELLA


Description:

The 208HR High Resolution Sputter Coaters from Cressington offer real solutions to the problems encountered when coating difficult samples for FESEM imaging. FESEM applications need extremely thin, fine-grained, uniform coatings to eliminate charging and to improve contrast on low density materials. In order to minimize the effects of grain size the 208HR offers a full range of coating materials and gives unprecedented control over thickness and deposition conditions. The 208HR Turbo Pumped High Vacuum System offers a wide range of operating pressures allowing precise control of both uniformity and conformity of the coating, minimizing charging effects. The HIGH / LOW chamber configuration allows easy adjustment of the distance from target to sample. The MTM-20 High Resolution Thickness Controller has a resolution of better than 0.1nm. This enables precise and reproducible thin coatings, especially in the range of 0.5 - 3nm, a thickness desirable for FESEM applications.
 
Preferred Coating Materials for FESEM Applications are:

  • Pt/Pd: General-purpose high resolution coating material for non-conducting specimens

  • Cr: Excellent for semi-conductor materials and high resolution back scattered electron imaging 

  • Ir: Excellent, virtually grain-free coating material

 
The 208HR system is available in a number of configurations to enable to deliver the best high resolution coatings for your applications. The208HR can be supplied with a standard rotary backing pump or a dry scroll pump for clean room applications. The standard 208HR includes both Chromium and Platinum/Palladium as target materials. There is also a 208HR Iridium including an Iridium target providing excellent fine-grained coating for high resolution FE-SEM imaging on a wide variety of samples.
 

Feature:

  • Wide choice of Coating Materials. Magnetron head design and effective gas handling allow a wide choice of target materials. 

  • Precision Thickness Control. Thickness optimized for FESEM operating voltage using the MTM-20 High Resolution Thickness Controller. 

  • Multi-angle Stage Movements. Separate rotary, planetary and tilting stage movements ensure uniform coating with excellent conformity, even on highly topographic samples. 

  • Multiple Sample Holders. Four sample holders are provided with options to accommodate sample sizes as large as 32mm diameter. 

  • Variable Chamber Geometry. Chamber geometry is used to adjust deposition rate to optimize structure. 

  • Wide Range of Operating Pressures. Independent power and pressure adjustment allows operation at argon gas pressure range of 0.2 - 0.005 mbar. 

  • Compact, Modern, Benchtop Design. Space and energy saving design eliminates need for floor space, water or specialized electrical connections. 

  • Ease of Operation. System operation and setup is very similar to standard sputter coating and does not require additional cleaning compared to ion beam coaters.

 
 

                                                                        208HR High Configuration                                      MTM-20 High Resolution Thickness Controller                             Rotary-Planetary-Tilting RPT Stage demonstrating variable speed
                                                                                                                                                                                                                                                                                             settings and adjustable tilt.


Configurations and Short Specifications of the 208HR

  • 208HR coating system with 150mm diameter chamber , 165 - 250mm variable height. 

  • Magnetron sputter head, shutter, Cr & Pt/Pd target or Ir target standard. Optional targets available are: Ag, Au, Au/Pd, Cr, Cu Fe, Ir, Mo, Nb, Ni, Pd, Pt, Pt/Pd, Ta. 

  • Sputter supply with full microprocessor control and digital independent current control. 

  • Pumping system with turbo drag / rotary pump combination, producing a fast pumpdown desktop system with all metal coupling and anti-vibration table for rotary pump. 

  • Optional dry scroll pump available for cleanroom applications. 

  • Integrated turbo molecular drag pump ensures fast pump down combined with high positive pumping speed during sputtering process. 

  • RPT sample stage with variable speed and 4 selectable sample holders 

  • MTM-20 High Resolution Thickness Controller, microprocessor controller with 0.1nm resolution

 
The complete High Resolution Sputter Coater 208HR is a complete solution and includes: pumping system, Thickness Controller MTM-20, Rotary-Planetary-Tilting sample Stage with 4 sample holders, Cr & Pt/Pd targets or Ir target.



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