Semicond, Wafer

Description

The all new VIS100/VIS200 series, a product by Motic for the industrial field, performs an online or offline probe application, visualization, inspection, observation, measurement, and documentation via monitor or LCD display.

The Ultimate High Accuracy Indent and Cleaving System for Semiconductor & Electronics Industries!


Description:

The PELCO® LatticeAx® 420 (formerly from LatticeGear™) provides the Highest level of Accuracy and Performance in the PELCO® LatticeAx® Indent and Cleaving System model lineup.

Description:

The PELCO® FlexScribe™ (formerly from LatticeGear™) is a super-fast, simple method for downsizing wafers and samples by scribing on the topside. It uses a scribing wheel mounted to a sliding scribing mechanism that always makes a straight scribe.