Wafer

Description

The all new VIS100/VIS200 series, a product by Motic for the industrial field, performs an online or offline probe application, visualization, inspection, observation, measurement, and documentation via monitor or LCD display.

Description

The PSM1000 is an OEM-ready instrument for the best images of flat, reflective specimens. Samples from metallurgy and the semiconductor field are treated by ELWD Plan Apochromatic objectives with a stupendous resolution power. The large FOV24 with an erect, true sided image allows fast orientation and manipulation work.

The Ultimate High Accuracy Indent and Cleaving System for Semiconductor & Electronics Industries!


Description:

The PELCO® LatticeAx® 420 (formerly from LatticeGear™) provides the Highest level of Accuracy and Performance in the PELCO® LatticeAx® Indent and Cleaving System model lineup.

Description:

The PELCO® FlexScribe™ (formerly from LatticeGear™) is a super-fast, simple method for downsizing wafers and samples by scribing on the topside. It uses a scribing wheel mounted to a sliding scribing mechanism that always makes a straight scribe.

Description

Motic Scientific’s PA80MET and PA120MET series microscopes feature a flexible, modular design that can be suited to your specific industrial inspection application.