X-7900 ULTRA (3D/CT)
High-precision semiconductor inspection system featuring 1μm resolution and ultra-fast 3D reconstruction for critical defect analysis.
Product Overview
The X-7900 Ultra is engineered for the rigorous demands of integrated circuit chips and semiconductor manufacturing. It provides unparalleled clarity for inspecting BGA, IGBT, and flip-chip assemblies, ensuring the highest standards of quality control through advanced planar and cone-beam CT imaging.
Main Features & Capabilities
3D/CT Reconstruction
Employs advanced algorithms for Cone-beam and Planar CT to generate high-resolution volumetric images of workpiece cross-sections.
Nano-Focus Accuracy
Features a minimum detection accuracy of 1μm, essential for identifying sub-micron defects in bonding wires and TSV/TGV processes.
Open Tube Longevity
Utilizes high-power 160KV Open Tube technology allowing for maintenance and consistent performance across high-duty cycles.
Multi-Axis Control
Integrated multi-axis motion control with a 70° detector tilt for comprehensive observation of complex component geometries.
Description & Key Benefits
System Specifications
| Category | Technical Parameter | Specification Detail |
|---|---|---|
| X-Ray Tube | Tube Type | 160KV Open Tube |
| Performance | Spatial Resolution | 1μm |
| Power | Tube Voltage/Current | 160KV / 500μA |
| Detector | FPD Resolution | 1536 x 1536px |
| Imaging | Magnification | 2000X (Optical) / 7500X (System) |
| Geometry | Detector Rotation | 70° Tilt |
| Structure | Stage Size | 670 x 670mm |
| Capacity | Sample Load | <10kg |
| Physical | Machine Weight | 2200kg |
| System | Operating System | Windows 11 |
Versatile Applications
Semiconductors
Critical inspection for BGA, IGBT, Flip-chip, and high-end IC packaging.
Advanced PCB
Validation of TSV/TGV processes, blind hole inspection, and press lamination.
Consumer Electronics
High-resolution inspection of FPC, bonding wires, and LCM display modules.
