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CTRM 750 Confocal Thermoreflectance Microscope
High-precision confocal and thermoreflectance microscope for non-contact 3D surface measurement, profile and roughness analysis, and sub-micron thermal imaging of microelectronic and advanced material structures.
Product Overview
The system combines a laser scanning confocal module with a thermoreflectance imaging module, enabling accurate surface profiling, roughness evaluation, dimensional inspection, and thermal distribution analysis on micro and submicron structures.
Its non-contact, non-destructive operating approach allows users to place a sample directly on the XY stage and begin measurement with minimal preparation. The optics are optimized for high measurement accuracy across the field of view, while intuitive software supports both novice and experienced users.
CTRM 750 is suitable for semiconductor devices, MEMS, FPD and display structures, thin film solar cells, coatings, tooling surfaces, glass structures, and thermal analysis of heat-generating micro devices. The open modular configuration also supports flexible customization for different research and inspection environments.
Key Specifications
- System TypeConfocal + Thermoreflectance microscope
- Objectives5x, 10x, 20x, 50x, 100x
- Confocal FOVUp to 2800 × 2100 μm depending on objective
- Thermal FOVUp to 1330 × 1330 μm depending on objective
- Spatial Resolution0.5 μm lateral
- Thermal Resolution1°C
- Heating RangeRT to 110°C
- Transient Mode50 nsec to 1 msec time resolution (FWHM)
- Light Source638 nm confocal laser + 12 pulse LED wavelengths for TR imaging
- Power Supply100 to 240 VAC, 50/60 Hz
Main Features
Non-Contact Measurement
Measures delicate surfaces without touching the sample, helping prevent surface damage and eliminating the need for complex sample preparation.
Reliable Confocal Data
High-NA objective lenses and dedicated optics optimized for the laser wavelength improve accuracy, reduce aberration, and capture the correct sample shape across the field of view.
Thermoreflectance Imaging
Measures reflectivity changes caused by temperature variation to provide high-resolution thermal imaging of microscopic areas beyond the limits of conventional infrared methods.
Flexible Configuration
Open modular design supports integration with other systems and can be customized for specific measurement and research requirements.
3D Profile & Roughness Analysis
Supports height, width, angle, area, volume, profile, and roughness measurements for cutting surfaces, films, coatings, and patterned microstructures.
Transient Thermal Imaging
Captures time-dependent thermal response through precise synchronization of pulsed light sources and imaging devices for advanced dynamic thermal analysis.
Confocal Measurement Principle
Laser Scanning Confocal Imaging
CTRM 750 confocal module provides laser scanning confocal imaging using a source, sample, and detector arrangement. By rejecting out-of-focus signals, only in-focus light is collected by the detector. This gives the system optical sectioning capability and improves image quality by reducing noise outside the focal point.
Height Measurement Method
To measure height, the microscope acquires multiple confocal images while automatically shifting the focus position along the Z axis. Because light intensity becomes maximum when the sample surface is at the focal plane, axial coordinates can be determined directly. The module uses a red laser, photo-multiplier tube (PMT), and piezoelectric axial scanner for reliable confocal optical sectioning.
Optical Performance & Analysis Capability
Expanded Optical Inspection Range
With its powerful optical performance, CTRM 750 enlarges the application area of optical microscope imaging. Features under transparent or semi-transparent layers can be inspected clearly, and surfaces of light-emitting or highly heated materials can be monitored more effectively than with conventional optical microscopes.
Profile and Roughness Analysis
The system supports intuitive profile analysis and roughness measurement for cutting surfaces, film surfaces, coatings, and precision-structured samples. This makes it highly suitable for both routine inspection and research-grade metrology tasks.
Application Fields
Semiconductor Inspection
IC patterns, bump height, wire loop height, CMOS features, defect inspection, CMP process checks, connector pins, and microelectronic heat distribution analysis.
Display & FPD Structures
Touch panel screen inspection, ITO pattern measurement, LCD column spacer height evaluation, and related fine-structure dimensional analysis.
MEMS & Micro Devices
3D profile measurement, surface roughness, micro heater analysis, micro transistor imaging, MEMS structures, and transient thermal response characterization.
Solar Cell & Glass Surfaces
Thin film solar cell inspection, solar cell texture evaluation, grism structures, laser pattern analysis, and surface feature measurement on transparent materials.
Coatings & Materials Research
Coating particle analysis, coating surface defect inspection, tooling surface evaluation, crack analysis, and film roughness measurement.
Thermal Analysis Applications
Heat-generating micro devices, poly-Si structures, carbon sheets, 4 μm pattern analysis, and microscopic thermal imaging where conventional IR methods reach their limits.
Thermoreflectance Imaging Principle
How It Works
The thermoreflectance imaging module measures the distribution of optical reflectance on the sample surface as temperature changes. By calculating reflectivity changes, the system derives surface temperature information and generates thermal images with excellent spatial resolution.
Why It Matters
This technology enables high-resolution micro-thermography in microscopic areas that cannot be achieved by conventional exotherm or infrared imaging techniques. It provides a powerful analytical tool for thermal analysis of microelectronic circuits and heat-generating structures.
Thermal Imaging Advantages
Brightness-to-Temperature Conversion
The system measures changes in reflectivity caused by brightness variation at different temperatures and converts them into temperature indication, enabling accurate interpretation of thermal distribution.
Multi-Wavelength Illumination
Thermoreflectance coefficient response depends on wavelength. CTRM 750 supports 12 pulse LED wavelengths in the default configuration, allowing flexible optimization for different materials and measurement targets.
Thermoelectric Heating Vacuum Plate
Reference Temperature Imaging
To interpret thermo-reflectance images as actual temperature information, reference images at specific temperatures are required. For this purpose, CTRM 750 includes a thermoelectric heating vacuum plate.
Fast, Stable Temperature Control
The plate uses a Peltier device and cooling fin structure for fast and accurate heating and cooling. A vacuum suction hole helps fix the sample in place, and an embedded temperature sensor monitors the plate temperature under software control.
Transient Thermal Imaging
Time-Resolved Thermal Response
The reflectivity change at specific time instances can be measured accurately through precise and timely control of the pulsed light source and imaging devices. This allows users to analyze how temperature changes with time, making transient thermal response one of the unique strengths of the thermoreflectance microscope.
Detailed Specifications
| Category | Parameter | Specification |
|---|---|---|
| Objective Lens | Magnification | 5x, 10x, 20x, 50x, 100x |
| Working Distance | 34 mm, 33.5 mm, 20 mm, 13 mm, 6 mm | |
| Numerical Aperture | 0.14, 0.28, 0.42, 0.55, 0.7 | |
| Field of View (Confocal Imaging Mode) | Horizontal | 2800 / 1400 / 700 / 280 / 140 μm |
| Vertical | 2100 / 1050 / 525 / 210 / 105 μm | |
| Field of View (Thermal Imaging Mode) | Horizontal | 1330 / 655 / 332 / 133 / 65 μm |
| Vertical | 1330 / 655 / 332 / 133 / 65 μm | |
| Confocal Imaging Mode | Optical Zoom | x1 to x6 |
| Total Magnification | 178x to 26700x | |
| Observation / Measurement Optics | Pinhole confocal optical system | |
| Frame Rate | 10 Hz to 160 Hz depending on pixel count | |
| Height Measurement | Measuring Range | 10 mm |
| Repeatability | σ 0.030 μm (Note 1) | |
| Width Measurement | Pixel Resolution | 1024×768, 1024×384, 1024×192, 1024×96 |
| Repeatability | 3σ 0.040 μm (Note 2) | |
| Confocal Light Source | Wavelength | 638 nm |
| Output | ~ 2 mW | |
| Laser Class | Class 3b | |
| Light-Receiving Element | PMT | |
| Thermal Imaging Mode | Imaging Sensor | Scientific CMOS |
| Spectral Range | 370 ~ 800 nm | |
| Active Imaging Pixels | 2048 × 2048 pixels | |
| Active Thermal Imaging Pixels | 1024 × 1024 pixels | |
| Spatial / Thermal Resolution | 0.5 μm lateral / 1°C | |
| Thermoreflectance Imaging | Imaging Modes | Steady state (Asynchronous FFT, 4-Bucket), Transient |
| Transient Time Resolution | 50 nsec ~ 1 msec (FWHM) | |
| Illumination for Thermoreflectance Microscope | Light Source Type | Pulse LEDs |
| Number of Wavelengths | 12 | |
| Output Power | 120 ~ 3000 mW (wavelength dependent) | |
| Default Wavelength Configuration | 430, 455, 470, 505, 530, 565, 590, 617, 625, 660, 700, 730 nm (customizable) | |
| Thermoelectric Heating Plate | Heating Range | RT to 110°C |
| Heating / Cooling Rate | Approx. 2 min from RT to 90°C, approx. 5 min from 90°C to RT (without sample) | |
| Data Processing Unit | Detected PC | PC-based processing system |
| Power Supply | Input Voltage | 100 to 240 VAC, 50/60 Hz |
| Current Consumption | 500 VA max. | |
| Weight | System Weight | Approx. 60 kg total (Measuring head approx. 19 kg / Controller approx. 8 kg) |
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