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PELCO LatticeAx® 420 - Indent and Cleaving Solution

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PELCO LatticeAx® 420 - Indent and Cleaving Solution Instruments TEDPELLA

The Ultimate High Accuracy Indent and Cleaving System for Semiconductor & Electronics Industries!


The PELCO® LatticeAx® 420 (formerly from LatticeGear™) provides the Highest level of Accuracy and Performance in the PELCO® LatticeAx® Indent and Cleaving System model lineup. The PELCO® LatticeAx® 420 delivers our highest cleaving accuracy of 10μm in less than 5 minutes making it ideal for any lab that values speed and high accuracy while at the same time needing to accommodate a variety of sample sizes, thicknesses and material types. The patented PELCO® LatticeAx® base is integrated with a complete vision package that includes a monocular microscope with 4μm optical resolution, color CCD camera and real-time image acquisition and display software, and an X-Y stage. This dedicated cleaving workstation is designed so any trained user can easily survey, align, micro-indent, cleave, and inspect processed samples.


  • Ultra high accuracy positioning of target (±10µm)

  • Focus mount with coarse and fine focus control

  • Monocular, parfocal, zoom lens (0.58-7x mag) with color CCD camera (computer and monitor not included)

  • Indent position control with 5µm step size

  • Polished tip diamond indenter 5-minute process sample setup to cleave

  • Simple to use, ergonomic design and small footprint

  • Cleaves a wide range of materials and sample sizes

  • Clock dial for indent depth calibration


Diamond Indenter

Cleaved Semiconductor

Delidded MEMS Device




SMB6 Cleaved with the LatticeAx®

Cleaved Sapphire Wafer

Cleaved Copper Film on Silicon


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