Atomic Solutions Sdn Bhd
33-01, Jalan Sagu 18,
Taman Daya,
81100 Johor Bahru,
Johor, Malaysia.
+6010-820 9965
+6018-989 9965
+607-362 1965
+60189899965
Kuala Lumpur Branch
21-3, Dataran Mutiara, Jalan 7/4, Taman Serdang Jaya, 43300 Seri Kembangan, Selangor, Malaysia.
+6018-989 9965
+607-362 1965

Penang Branch
8, 1st Floor, Tingkat Bukit Minyak 9, Taman Bukit Minyak, 14000 Bukit Mertajam, Pulau Pinang, Malaysia.
+6017-466 0195
+6018-989 9965
+607-362 1965

PELCO LatticeAx® 420 - Indent and Cleaving Solution

Previous 3 / 10 Next

PELCO LatticeAx® 420 - Indent and Cleaving Solution Instruments TEDPELLA


The Ultimate High Accuracy Indent and Cleaving System for Semiconductor & Electronics Industries!


Description:


The PELCO® LatticeAx® 420 (formerly from LatticeGear™) provides the Highest level of Accuracy and Performance in the PELCO® LatticeAx® Indent and Cleaving System model lineup. The PELCO® LatticeAx® 420 delivers our highest cleaving accuracy of 10μm in less than 5 minutes making it ideal for any lab that values speed and high accuracy while at the same time needing to accommodate a variety of sample sizes, thicknesses and material types. The patented PELCO® LatticeAx® base is integrated with a complete vision package that includes a monocular microscope with 4μm optical resolution, color CCD camera and real-time image acquisition and display software, and an X-Y stage. This dedicated cleaving workstation is designed so any trained user can easily survey, align, micro-indent, cleave, and inspect processed samples.
 

Feature:

  • Ultra high accuracy positioning of target (±10µm)

  • Focus mount with coarse and fine focus control

  • Monocular, parfocal, zoom lens (0.58-7x mag) with color CCD camera (computer and monitor not included)

  • Indent position control with 5µm step size

  • Polished tip diamond indenter 5-minute process sample setup to cleave

  • Simple to use, ergonomic design and small footprint

  • Cleaves a wide range of materials and sample sizes

  • Clock dial for indent depth calibration

 
 
Applications:

Diamond Indenter

Cleaved Semiconductor

Delidded MEMS Device

 

 

 

SMB6 Cleaved with the LatticeAx®

Cleaved Sapphire Wafer

Cleaved Copper Film on Silicon

 
 

Please leave your enquiry here, we will reply as soon as possible.
Name*  
Company Name  
Product Interested  
Quantity  
Email*  
Contact No.*  
Attachment  
*only support gif, jpeg, jpg, png, pdf
Messages*  

Switch to Mobile Version