Description
The surface roughness of a wafer is critical in determining the performance of a semiconductor device. For the state-of-the-art device manufacturer, both chip makers and wafer suppliers are demanding more accurate roughness control of ultra-flat surface on Si or SOI wafers. By delivering the industry’s lowest noise floor of less than 0.5 Å and combining it with True Non-Contact™ mode, Park NX-Wafer can reliably acquire sub-Angstrom roughness measurements with minimum tip-to-tip variation. Park's Crosstalk Elimination also allows very flat orthogonal XY scanning with no background curvature, even on the flattest of surfaces regardless of scan location, rate, and size. This enables very accurate and repeatable surface measurement from micro-roughness to long-range waviness.

Feature

• Live monitoring of the measurement process

• Automatic analysis of acquired measurement data

• Editable measurement method for each automated routine

• Auto, semi-auto, and manual mode so you have complete control

 
Application

Defect Review for Bare Wafers and Substrates
The new 300mm bare wafer ADR provides a fully automated defect review process from transfer and alignment of defect maps to the survey and zoom-in scan imaging of defects that uses a unique remapping process that does not require any reference marker on a sample wafer. Unlike SEM which leaves square-shaped destructive irradiation marks on defect sites after its run. The AFM-based defect review enables non-destructive 3D imaging of defects as small as a few nanometers. The linkage between a defect inspection tool and the AFM is carried out by advanced coordinate translation with enhanced vision technique. Since it is fully automated, it does not require any separate steps to calibrate the stage of the targeted defect inspection system, increasing throughput by up to 1,000%.


Transfer and Alignment of Defect Maps with Enhanced Vision
By utilizing Park's proprietary coordinate translation technique, the new Park ADR AFM can accurately transfer the defect maps obtained from a laser-scattering defect inspection tool to a 300mm Park AFM system. This technology does not require any separate step to calibrate the stage of the targeted defect inspection system and allows full automation for high throughput defect imaging.